AMD Introduces Ryzen Embedded V3000 Series CPUs

AMD CloudFest

With the launch of the Ryzen Embedded V3000 Series processors from AMD, their V-Series portfolio now includes the high-performance ‘Zen 3’ core. It would provide reliable, scalable processing performance for a variety of server storage and networking system applications.

The new AMD Ryzen Embedded V3000 Series processors provide the performance and low-power options necessary for some of the most demanding 24×7 operating environments and workloads. They do this by having higher CPU performance, DRAM memory transfer rate, CPU core count, and I/O connectivity when compared to the AMD Ryzen Embedded V1000 series.

Rajneesh Gaur, Corporate VP and GM, Embedded Solutions Group, AMD
“AMD Ryzen Embedded V3000 processors deliver a robust suite of features with advanced benefits required for superior workload performance in enterprise and cloud storage and networking products,” said Rajneesh Gaur, Corporate VP and GM, Embedded Solutions Group, AMD.

AMD Ryzen Embedded V3000 processors, which are now shipping to top embedded ODMs and OEMs, would meet the rising demands of enterprise and cloud storage as well as data center network routing, switching, and firewall security capabilities. Advanced server systems at the edge to virtual hyper-converged infrastructure may both be powered by AMD Ryzen Embedded V3000 CPUs.

“We designed AMD Ryzen Embedded V3000 processors for customers seeking a balance of high-performance and power-efficiency for a wide range of applications in a compact BGA package,” said Rajneesh Gaur, Corporate Vice President and General Manager, Embedded Solutions Group, AMD. “AMD Ryzen Embedded V3000 processors deliver a robust suite of features with advanced benefits required for superior workload performance in enterprise and cloud storage and networking products.”

Server Storage and Networking

For server storage and networking systems, AMD Ryzen Embedded V3000 processors are offered in four-, six-, and eight-core configurations with low thermal design power (TDP) profiles ranging from 10W to 54W, enabling a precise balance of performance and power efficiency in a small form factor. With ball grid array (BGA) packaging and low thermal dissipation, the new AMD Ryzen Embedded V3000 CPU family would enable server system designers to utilize a single board design for a wide range of system configurations, facilitating system integration.

“Storage and networking require a different balance of data processing performance, data movement, power management and thermal management than traditional compute. Processors for storage and networking require compute, memory and I/O capabilities balanced for rack space utilization, power efficiency and low heat dissipation in space-constrained environments,” said Shane Rau, Research Vice President, Computing Semiconductors, IDC. “The market for storage and networking will demand x86-compatible processors optimized for core data center and edge infrastructure systems and processor vendors offering them will help their OEM customers significantly expand their system TAM while leveraging their existing investments in the x86 ecosystem.”