AMD Unveils Workload-Tailored Server Processor with 3D Die Stacking Technology

AMD has announced the public availability of its 3rd Gen AMD EPYC CPUs featuring AMD 3D V-Cache technology, originally codenamed ‘Milan-X.’ It’s a data center CPU which uniquely utilizes 3D die stacking. These processors, based on the ‘Zen 3’ core architecture, expand the 3rd Gen EPYC CPU family. According to AMD, they can provide up to a 66 percent performance boost over equivalent, non-stacked 3rd Gen AMD EPYC processors across a number of specified technical computing workloads.

These new processors have the largest L3 cache in the industry, stated AMD. The new server processers would deliver the same socket, software compatibility, and modern security features as 3rd Gen AMD EPYC CPUs, while delivering outstanding performance for technical computing workloads like computational fluid dynamics (CFD), finite element analysis (FEA), electronic design automation (EDA), and structural analysis.

These workloads can be important design tools for firms that need to simulate the intricacies of the physical world in order to test and verify engineering designs for some of the world’s most innovative products.

“Building upon our momentum in the data center as well as our history of industry-firsts, 3rd Gen AMD EPYC processors with AMD 3D V-Cache technology showcase our leadership design and packaging technology enabling us to offer the industry’s first workload-tailored server processor with 3D die stacking technology,” said Dan McNamara, senior vice president and general manager, Server Business Unit, AMD. “Our latest processors with AMD 3D V-Cache technology provide breakthrough performance for mission-critical technical computing workloads leading to better designed products and faster time to market.”

AMD 3D V-Cache Technology

Increases in cache capacity have been at the forefront of speed enhancements, stated AMD. Especially for technical computing applications that rely significantly on big data sets. Increased cache size would benefit certain workloads, however 2D chip designs have physical restrictions on the amount of cache that can be put on the CPU, added AMD.

By attaching the AMD ‘Zen 3’ core to the cache module, AMD 3D V-Cache technology would overcome these physical obstacles by expanding L3 while reducing latency and improving throughput. This technique can b a game-changer in CPU design and packaging, allowing for “breakthrough performance” in specific technical computing applications.

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Photo Dan McNamara, senior vice president and general manager, Server Business Unit, AMD
“Our latest processors with AMD 3D V-Cache technology provide breakthrough performance for mission-critical technical computing workloads,” said Dan McNamara, senior vice president and general manager, Server Business Unit, AMD.

Enhanced Performance

One of the world’s highest performance server processors for technical computing, the 3rd Gen AMD EPYC processors with AMD 3D V-Cache technology would deliver faster time-to-results on targeted workloads, such as:

  • EDA – The 16-core, AMD EPYC 7373X CPU can deliver significantly faster simulations on Synopsys VCS, when compared to the EPYC 73F3 CPU
  • FEA – The 64-core, AMD EPYC 7773X processor can deliver, the highest performance on Altair Radioss simulation applications
  • CFD – The 32-core AMD EPYC 7573X processor can solve quite some CFD problems per day while running Ansys CFX

Users would be able to install fewer servers and minimize data center power usage as a result of these performance capabilities, lowering total cost of ownership (TCO), reducing carbon footprint, and achieving their environmental sustainability goals. Using 2P 32-core AMD EPYC 7573X CPU based servers can reduce the estimated number of servers required “from 20 to 10” and lower power consumption.

Industry-wide Ecosystem Support

Atos, Cisco, Dell Technologies, Gigabyte, HPE, Lenovo, QCT, and Supermicro are among the OEM partners offering 3rd Gen AMD EPYC CPUs with AMD 3D V-Cache technology today.

AMD software ecosystem partners such as Altair, Ansys, Cadence, Dassault Systèmes, Siemens, and Synopsys all support 3rd Gen AMD EPYC CPUs with AMD 3D V-Cache technology.

The virtual machines (VMs) in Microsoft Azure HBv3 have now been fully updated to AMD EPYC 3rd Gen with AMD 3D V-Cache technology. According to Microsoft, HBv3 VMs are the most widely accepted addition to the Azure HPC platform ever, with performance benefits of up to 80% in important HPC workloads thanks to the inclusion of AMD 3D V-Cache over earlier HBv3 series VMs.