Huawei has launched a new-generation high-performance computing (HPC) platform, the FusionServer X6000, at the Supercomputing Conference 2016 (SC16). Huawei‘s new-generation FusionServer X6000 HPC platform, based on the Intel Scalable System Framework, would provide the balanced performance, scalability, and flexibility to efficiently handle a wide range of HPC workloads.
The X6000 HPC platform adopts an “innovative” liquid cooling solution, which features a skive fin micro-channel heat sink for CPU heat dissipation and processing technology where water flows through memory modules. The platform would deliver a node liquid cooling percentage greater than 85%. Its modular design and 50ºC warm water cooling function would offer customers high energy-efficiency and flexible deployment, and reduce total cost of ownership (TCO) by up to 40% for large-scale deployment.
“With outstanding R&D capabilities and comprehensive product portfolios in the IT domain, Huawei joins hands with industry partners to build joint innovation centers around the globe,” said William Dong, Vice President of Data Center Solution Sales, Huawei Enterprise BG. “We are dedicated to providing our customers IT infrastructures with leading technologies, as well as innovative HPC cloud, HPC, and Big Data solutions to help customers achieve business success.”
The Huawei HPC platform also accommodates four 2-socket server nodes in a 2U chassis and presents an all-flash storage capability of 24x NVMe SSDs per chassis. Based on the high bandwidth and low latency features of 100 Gbps networks, the X6000 HPC platform would be able to achieve a single-node throughput of 4.8 million IOPS.