Iceotope Breaks 1000W Chip Cooling Barrier with Its Liquid Cooling

Iceotope boothBy going above the 1000W threshold in chip-level cooling, Iceotope Labs, a premier supplier of Precision Liquid Cooling technologies, has accomplished a vital milestone. The new achievement of the firm, which is described in their white paper ‘Achieving chip cooling at 1000W and beyond with single-phase Precision Liquid Cooling,’ highlights the efficiency of single-phase liquid cooling in accomplishing high-power chip cooling.

These days, liquid cooling is becoming more and more popular in the data center business as a sustainable option because artificial intelligence (AI) needs high compute densities and because IT equipment’s thermal design power is growing. This accomplishment by Iceotope Labs could proof to be crucial because it gives data center owners peace of mind that their infrastructure investments will be able to support future 1000W to 2000W CPU and GPU power needs.

The precision liquid cooling technique of Iceotope Labs was put through extensive testing to confirm its performance. Key findings revealed compelling results:

  • When exposed to a 1000W heat load from Intel’s Airport Cove thermal test vehicle (TTV), Iceotope’s copper pinned KUL SINK demonstrated an outstanding thermal resistance of 0.039 K/W at a flow rate of 7 l/min.
  • In comparison to a test of a comparable design using a tank immersion product with a forced-flow heatsink, this indicates a 11.4% increase in thermal resistance. As power grew from 250W to 1000W, thermal resistance was almost constant, providing assurance that the technology can stably withstand larger power levels.
  • Announcing the technology’s better thermal performance over competing liquid cooling technologies, Neil Edmunds, Vice President of Product Management at Iceotope, praised the accomplishment as a significant industry milestone. He was certain that testing at higher power levels would prove the cooling properties of the solution on its own.

Mohan J. Kumar, an Intel Fellow, agreed that achieving a 1000W cooling capacity is essential to establishing the foundation for higher thermal design power silicon. This innovation from Iceotope would not only solve the cooling problems of today, but it would also set the stage for future data center and Edge cluster solutions that are efficient.

To achieve even greater power levels in a safe, sustainable, and scalable way, Iceotope is still dedicated to pushing the frontiers of cooling technology. Precision Liquid Cooling systems from Iceotope would provide a viable way to meet the changing cooling demands of the industry as demand for high-performance computing (HPC) keeps growing.

Download the white paper by clicking HERE to get the full testing findings.