Innodisk Unveils Compact, Server-Ready DRAM to Tackle AI and IoT Challenges At The Edge

Computational power is gradually moving out to the edge of our applications. By handling data locally, latency can be reduced as the edge device can intelligently decide what data needs to be sent to the cloud. This is why Innodisk is launching its newest DDR4 WT RDIMM VLP now to “weather harsh conditions and deliver lasting performance.”

Innodisk’s “high-performance,” wide-temperature RDIMM VLP is optimized for server use, especially in tough conditions.

Innodisk’s newest RDIMM VLP is optimized for server use, especially in tough conditions ‘as an edge device.’

The RDIMM includes both single bit error correction as well as a register to enhance clock, command and control signals. Innodisk offers 2666MT/s wide temperature RDIMM that can handle temperature variations from -40 degree Celsius to 85 degree Celsius. The very low-profile (VLP) would ensure that the modules are an easy fit on any 1U platform while also allowing for better airflow, thus making it a fitting solution for fan-less systems.

Intel CPU Compatibility

The RDIMM VLP is also compatible with the newest Intel CPUs such as Xeon and Core. As with all Innodisk DDR4 DRAM modules, this module uses anti-sulfuration components to ensure unimpeded performance in high-sulfur environments.

“The market is shifting towards the edge,” said Samson Chang, VP of Global Embedded and Server DRAM Business Unit, Innodisk. “We need to ensure that the needed memory performance is in place for the next generation of AI and IoT devices. Our newest RDIMM VLP is more than just a traditional server module in that it is made to last in the toughest conditions that edge computing can throw at us.”