Intel and Arm Join Forces to Develop Low-Power SoCs for Various Industries

ARM

Intel Foundry Services (IFS) and Arm have announced a multi-generational collaboration that will allow chip designers to develop system-on-chips (SoCs) using Intel’s 18A technology, combined with Arm’s CPU IP, in order to create low-power computing systems. The collaboration will focus on mobile SoC designs initially, with the possibility of expanding into other fields, such as data center, IoT, automotive, aerospace, and government applications in the future. 

The agreement will offer Arm’s customers access to IFS’s manufacturing footprint, which includes U.S. and EU-based capacity, along with Intel’s 18A process technology, which brings new transistor technologies for improved performance and power.

Pat Gelsinger, CEO of Intel Corporation, stated that “there is growing demand for computing power driven by the digitization of everything, but up until now fabless customers have had limited options for designing around the most cutting-edge mobile technology.” He further added that this collaboration would “increase the market potential for IFS and open up new options and approaches for any fabless company that wants access to best-in-class CPU IP and the power of an open system foundry with cutting-edge process technology.”

Arm’s CEO, Rene Haas, said, “Arm’s secure, energy-efficient processors are at the core of hundreds of billions of devices and the digital experiences on the planet,” and highlighted the need to innovate on multiple levels as the computing requirements become more sophisticated. Mr. Haas sees IFS as a crucial foundry partner for Arm’s clients as they deliver the next wave of revolutionary Arm-based solutions.

Arm Cores

Arm CEO - Rene Haas
Arm CEO Rene Haas sees Intel as a crucial foundry partner for Arm’s clients as they deliver the next wave of revolutionary Arm-based solutions.

To increase power, performance, area, and cost (PPAC) for Arm cores targeting Intel 18A process technology, IFS and Arm will engage in design technology co-optimization (DTCO), where chip design and process technologies are improved simultaneously. The collaboration will create a mobile reference design that will enable foundry customers to see a demonstration of the system and software expertise, and optimize the platforms from apps and software to packaging and silicon, employing Intel’s unique open system foundry concept. The collaboration will aid the industry’s transition from DTCO to system technology co-optimization (STCO).

Intel’s IDM 2.0 plan, which includes substantial investments in manufacturing capacity globally, is part of its long-term strategy to meet the continued demand for chips. The partnership between IFS and Arm will make it possible for Arm partners to benefit from Intel’s open system foundry strategy, which extends beyond conventional wafer manufacturing to encompass packaging, software, and chiplets. By unlocking Arm’s computing portfolio and world-class IP on Intel process technology, the collaboration aims to create a more balanced global supply chain.

The collaboration between IFS and Arm would allow for greater flexibility for chip designers to use cutting-edge mobile technology in their designs, which will result in the creation of innovative solutions for various industries. The partnership would provide customers with the opportunity to combine Arm’s processor technology with Intel’s manufacturing capabilities, providing access to best-in-class CPU IP and the power of an open system foundry with cutting-edge process technology.