Super Micro Computer has unveiled a new 2-Node 4U FatTwin platform featuring two ultra high performance compute nodes, each supporting dual Intel Xeon E5-2600 v2 Ivy Bridge’ processors (up to 130W TDP) and up to six Intel® Many Integrated Core (MIC) based Intel Xeon Phi Coprocessors.
The High Performance Computing (HPC) optimized supercomputing solution will be exhibited by Supermicro at the Supercomputing 2013 (SC13) conference this week in Denver, Colorado.
Also making their debut at the SC13 are new 2U TwinPro and TwinPro² SuperServers, the second generation Twin architecture from Supermicro featuring greater memory capacity up to 16x DIMMs, 12Gb/s SAS 3.0 support, NVMe optimized PCI-E SSD interface, additional PCI-E expansion slots, 10GbE and onboard QDR/FDR InfiniBand for maximized I/O and support for a full-length, double-width Xeon Phi coprocessor per node in the 2U TwinPro.
Key-features of the FatTwin platform include:
- 4U 12x Xeon Phi FatTwin (SYS-F647G2-FT+) – 2-node system featuring 6x Intel® Xeon Phi Coprocessors per node with Front I/O, Redundant Platinum Level high efficiency power supplies and hot-swap cooling fans. Each node supports dual Intel Xeon E5-2600 v2 (up to 130W TDP) processors, 16x DDR3 Reg. ECC DIMMs, 10GbE onboard option and 8x 2.5″ hot-swap SAS/SATA/SSD bays.
Key-features of the SuperServers include:
- 2U TwinPro (SYS-2027PR-DTR) / TwinPro² (SYS-2027PR-HTR) – Supermicro takes its 2U Twin architecture to the next level of performance, flexibility and expandability with the high efficiency 2-node TwinPro and high density 4-node TwinPro². Each node supports dual Intel Xeon E5-2600 v2 processors and the 2-node 2U TwinPro accommodates an Intel Xeon Phi Coprocessor with support for two additional add on cards per node. The SuperServers feature greater memory capacity up to 16x DIMMs, 12Gb/s SAS 3.0 support, NVMe optimized PCI-E SSD interface, additional PCI-E expansion slots, 10GbE and onboard QDR/FDR InfiniBand for maximized I/O.